PaceTec develops and manufactures customized Wet Bench systems for wet chemical etching processes in semiconductor, electronics and high-tech industries.
Our systems enable controlled etching, structuring, cleaning and surface modification processes with high process stability and reproducibility.
PaceTec is a specialist for customized Wet Bench systems used in industrial wet chemical etching processes.
Our systems are designed for semiconductor manufacturing, MEMS, microelectronics, glass processing and medical technology applications.
By combining process engineering, material knowledge and equipment design, PaceTec develops reliable solutions for controlled wet chemical processes with high reproducibility and process stability.
What is Wet Chemical Etching?
Wet chemical etching (also known as Wet Etching) is a process used for the controlled removal of materials through chemical reactions with liquid process media.
During this process, material is selectively removed in order to:
- remove layers
- structure surfaces
- create defined geometries
- prepare materials for subsequent processes
Wet chemical etching is used in many high-tech industries:
- semiconductor industry
- microelectronics
- MEMS manufacturing
- medical technology
- glass processing
- research applications
Wet Chemical Etching Systems from PaceTec
PaceTec develops customized Wet Bench systems for demanding wet chemical etching applications.
Our systems enable controlled chemical processes including:
- HF etching
- KOH silicon etching
- oxide layer removal
- glass structuring
- surface cleaning
- microstructure formation
PaceTec Wet Bench systems are individually engineered according to customer requirements, including:
- chemical compatibility
- material selection
- process temperature requirements
- automation level
- cleanroom requirements
- process safety concepts
PaceTec supports customers from process definition through system engineering and implementation of customized wet processing equipment.
Why is Wet Chemical Etching Used?
Many modern products require precisely defined surface properties.
Through chemical etching, material characteristics can be specifically modified and controlled.
Typical Objectives:
- removal of thin layers
- surface structuring
- creation of defined surface roughness
- preparation for coating processes
- improvement of adhesion properties
How Does Wet Chemical Etching Work?
During wet etching, a chemical medium reacts with the material being processed.
Process Sequence:
- contact between material and etching medium
- chemical reaction at the surface
- dissolution of material
- removal of reaction products
- rinsing and cleaning
The speed of material removal is defined as the etching rate.
Important Process Parameters in Etching
The quality of an etching process depends on several factors.
Chemistry
The selection of the etching medium determines:
- material removal rate
- selectivity
- surface quality
Temperature
Increasing the temperature can accelerate the chemical reaction rate.
Process Time
The etching duration influences:
- etch depth
- material removal
- structure dimensions
Concentration
Chemical concentration influences:
- etch rate
- selectivity
- process stability
Wet Etching vs Dry Etching
Wet chemical etching and dry etching are two important technologies used for material removal and surface structuring.
Wet chemical etching uses liquid chemical solutions to selectively remove materials through controlled chemical reactions.
Compared with dry etching, wet etching offers:
- high material selectivity
- excellent chemical process control
- large-area processing capability
- efficient material removal
- cost-effective industrial solutions
The selection between wet and dry etching depends on:
- material properties
- required structure geometry
- etching depth
- surface requirements
- production volume
PaceTec develops Wet Bench systems optimized for specific wet chemical etching applications.
Important Wet Chemical Etching Processes
The most important industrial wet chemical etching processes include:
- HF etching
- KOH etching
- phosphoric acid etching
- sulfuric acid / peroxide processes
- titanium etching
- glass etching
HF Etching
Removal of oxide layers and silicon oxide.
HF stands for:
Hydrofluoric Acid
HF is one of the most important chemicals used in wet chemical surface processing.
How HF Etching Works
HF reacts particularly well with oxide-based materials.
An important example is silicon oxide:
SiO₂ + HF → soluble fluoride compounds
This allows controlled removal of oxide layers.
Typical Applications of HF Etching
- removal of native oxide layers
- wafer preparation
- surface activation
Glass Processing
- chemical structuring
- surface modification
Advantages of HF Etching
- highly selective oxide removal
- defined surface properties
- preparation for subsequent processes
HF Dip Process
The HF Dip process is a specific application of HF etching.
During this process, components or wafers are briefly immersed into an HF solution.
Objective:
- removal of native oxide layers
- surface activation
Typical process sequence:
- cleaning
- HF Dip
- rinsing
- drying
KOH Etching
Silicon Etching Using Potassium Hydroxide
KOH stands for Potassium Hydroxide.
KOH is an important etching medium for silicon and is widely used for microstructuring applications.
KOH Etching Operating Principle
KOH reacts with silicon and chemically dissolves the material.
The etching rate strongly depends on the crystallographic orientation of the silicon.
This results in an anisotropic etching process.
What Does Anisotropic Etching Mean?
During anisotropic etching, different crystal orientations are removed at different rates.
This enables the creation of precisely defined structures.
Typical applications:
- MEMS
- sensors
- micromechanical components
Applications of KOH Etching
Semiconductor Technology
- silicon structuring
- micro-components
MEMS Technology
- sensor structures
- movable micro-elements
Glass Processing
Under certain conditions, KOH can also be used for processing specialized glass materials.
Glass Etching
Chemical Processing of Glass Surfaces
Glass etching enables the targeted modification of glass surfaces.
Applications:
- microchannels
- sensors
- optical components
- specialized glass processing
Why is Glass Etching Used?
Through etching processes, the following structures can be created:
- defined surface structures
- recesses and cavities
- micro-scale geometries
Typical Glass Etching Processes
HF-Based Glass Etching
HF can dissolve silicate structures within glass.
Applications:
- microstructuring
- surface processing
KOH-Based Processes
Depending on the glass composition, alkaline processes can be used for controlled material removal.
Silicon Etching
Structuring of Silicon Surfaces
Silicon is one of the most important materials in modern microelectronics.
Wet chemical silicon etching is used for:
- microstructures
- sensors
- MEMS devices
- semiconductor processes
Isotropic and Anisotropic Etching
Isotropic Etching
Material is removed at a similar rate in all directions.
Advantages:
- uniform material removal
- effective cleaning capability
Anisotropic Etching
Material removal depends on the crystal structure.
Advantages:
- defined geometries
- precise microstructuring
Titanium Etching
Surface Processing for
Medical Technology
Titanium is widely used due to its excellent material properties for:
- implants
- medical components
- precision parts
Why is Titanium Etched?
Chemical treatment can modify:
- surface structure
- surface roughness
- adhesion properties
This can influence the interaction between implants and biological environments.
Applications of Titanium Etching
- dental implants
- orthopedic implants
- medical components
Industrial Etching Chemicals
| Chemical | Typical Application |
| HF | Oxides, glass, silicon oxide removal |
| KOH | Silicon etching |
| H₃PO₄ | Silicon nitride removal |
| H₂SO₄/H₂O₂ | Oxidative cleaning processes |
| HNO₃ | Metal processing |
Requirements for Etching Systems
Professional wet chemical etching processes require precisely controlled process equipment.
A reliable etching system must ensure stable chemical conditions, reproducible process results and safe handling of process media.
Important requirements include:
- chemical resistance of all process-contacting materials
- safe handling of aggressive process chemicals
- precise temperature control
- reproducible process times
- defined rinsing processes
- stable process conditions
- operator and process safety
Process Control in PaceTec Wet Bench systems
The quality of wet chemical etching processes depends on accurate control of all relevant parameters.
Important process parameters include:
- chemical concentration
- process temperature
- etching time
- chemical flow and exchange
- rinsing quality
- drying conditions
Precise process control enables consistent surface quality and reproducible etching results.
Wet Bench Systems for Etching Processes
A suitable Wet Bench system enables controlled execution of demanding wet chemical processes.
PaceTec Wet Bench systems are used for applications where chemical precision, process stability and repeatability are essential.
A professional Wet Bench solution enables:
- controlled chemical supply
- safe process execution
- reproducible etching rates
- automated process sequences
- defined rinsing and drying processes
- high process repeatability
Automated Wet Processing
Automated PaceTec Wet Bench systems provide significant advantages for industrial production environments.
Typical functions include:
- automatic chemical dosing
- recipe-controlled processes
- process monitoring
- data recording
- automated transport systems
- repeatable production cycles
PaceTec Expertise
PaceTec develops customized Wet Bench systems for demanding wet chemical etching processes in semiconductor, electronics and high-tech industries.
Our solutions support:
- HF etching processes
- KOH etching applications
- glass processing applications
- silicon etching processes
- MEMS manufacturing processes
- microelectronics applications
- medical surface treatment
During system development, PaceTec considers:
- material compatibility
- chemical requirements
- process parameters
- automation requirements
- safety concepts
- customer-specific production requirements
Customized Wet Bench Engineering
Every wet chemical process has specific requirements regarding chemistry, materials and process control.
PaceTec develops customized solutions based on:
Process Requirements + Chemistry + Material Knowledge + Equipment Engineering
Our engineering approach combines:
- process understanding
- chemical compatibility analysis
- mechanical design
- automation concepts
- production integration
This enables reliable Wet Bench systems for advanced manufacturing environments.
Customized Wet Bench Solutions for Industrial Etching Applications
Modern wet chemical etching processes require precisely engineered systems that combine chemical compatibility, process stability and reliable automation.
PaceTec develops customized Wet Bench systems for applications where highest demands are placed on:
- process control
- surface quality
- chemical safety
- repeatability
- production reliability
- long-term process stability
Integrated Process Engineering
A successful wet etching solution requires the interaction of multiple disciplines:
Chemistry + Material + Process Parameters + Equipment Engineering
PaceTec supports customers from initial process requirements through system design and implementation of customized wet processing equipment.
Wet Etching Applications Supported by PaceTec
PaceTec Wet Bench systems are designed for demanding applications including:
- semiconductor wafer processing
- MEMS manufacturing
- microelectronics production
- glass structuring processes
- silicon surface processing
- medical component surface treatment
Wet Chemical Processing Equipment for High-Tech Industries
High-tech manufacturing requires reliable equipment for precise chemical processes.
PaceTec Wet Bench systems enable controlled and reproducible processing for advanced industrial applications.
Key advantages:
- application-specific system design
- high chemical compatibility
- stable process conditions
- reproducible surface results
- integration into automated production environments
Reliable Wet Processing Equipment for Advanced Manufacturing
Through customized engineering and application-specific solutions, PaceTec enables stable and reproducible wet chemical processes for advanced manufacturing environments.
Our Wet Bench systems support customers in achieving:
- consistent product quality
- optimized process performance
- reduced process variation
- increased production reliability
PaceTec combines engineering expertise, process knowledge and customized equipment design to deliver reliable solutions for industrial wet chemical applications.