As semiconductor device geometries continue to shrink, the demand for highly controlled wet chemical cleaning and oxidation processes is increasing. In particular, controlling particles, organic residues, and surface reactions requires extremely stable and reproducible process conditions.
PaceTec developed an advanced ozone wet processing test module (OFR/O₃ system) designed specifically for the development and optimization of modern cleaning processes in 300-mm wafer environments.
Process Focus: Ozone-Based Surface Cleaning and Process Development
The test module supports the development of key semiconductor wet processes:
- Ozone-enhanced wafer cleaning and surface activation
- Process development for particle and contamination reduction
- Optimization of SC cleaning and oxidation processes
- Investigation of metal and organic residues
- Development of stable advanced wet cleaning processes
Precise control of ozone interaction in the liquid phase enables targeted analysis and optimization of reaction mechanisms, mass transfer, and surface kinetics.
Core Technology by PaceTec
The platform developed by PaceTec combines high-precision process control with modern wet processing architecture:
- Fully enclosed ozone process chamber without emissions
- Precise control of gas and liquid phase processes
- Integrated real-time monitoring of pressure, temperature, and flow
- Controlled bubble formation for optimized mass transfer
- Modular architecture for flexible process configurations
- Cleanroom-compatible and 300-mm semiconductor-ready system design
- Full integration into wet bench development environments
Safety and Process Stability
For use in highly sensitive semiconductor environments, the system was consistently designed for maximum safety:
- Fully enclosed, ozone-tight process architecture
- Multi-layer safety and monitoring systems
- Automatic process shutdown in case of deviations
- High-purity material concept for all media-contacting components
- Integrated leak detection and system monitoring
Benefits for Semiconductor Development and Production
The ozone wet processing test module offers decisive advantages for R&D and process development:
- Improved stability of wet chemical cleaning processes
- Faster development of new semiconductor cleaning processes
- Higher reproducibility of critical surface treatments
- Data-driven process optimization for future scaling
- Reduced defect density through controlled ozone reactions
PaceTec as a Specialist in Wet Processing and Ozone Technology
PaceTec develops custom high-end systems for the semiconductor industry, including:
- Wet bench systems for semiconductor cleaning
- Ozone and oxidation process platforms
- Process development and test modules
- Custom high-purity equipment solutions
PaceTec stands for precise process control, highest material purity, and deep understanding of modern semiconductor wet processing requirements.
Conclusion
The OFR/O₃ wet processing test module is a key technology for the next generation of semiconductor cleaning. It combines precise ozone process control, maximum safety, and data-driven process development in a modular, cleanroom-ready system design.
With this solution, PaceTec actively supports the further development of innovative wet processes in the global semiconductor industry.
